Capcon Singapore

Capcon Singapore designs and builds die bonders for advanced integrated-circuit packaging, with its main research and development base in Singapore and additional teams in Suzhou, Beijing and Taiwan. Its equipment covers wafer-level and panel-level packaging, flip chip, system-in-package and stack die processes, organised across six product series. Incorporated in 2017, the company has supplied close to thirty customers including seven of the ten largest chipmakers worldwide, signed a three-year supply agreement with ASE, and raised roughly fifty million US dollars in Series B2 funding.

Headquarters: Singapore 737663